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Mechanical Engineer

Photonect Interconnect Solutions

Rochester, NYFull-timePosted 4mo agoStill listed 3 days ago

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At a glance

Compensation
No compensation found
Location
Rochester, NY
Role Type
Internship
Schedule
Full-time
Work Authorization
US work authorization required

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Requirements

Credentials this posting asks for.

Bachelor's degree

Job overview

Photonect Interconnect Solutions is hiring a Mechanical Engineer. Photonect is seeking a talented Mechanical Engineering Intern to join their innovative team. This role involves developing next-generation optical fiber to photonic integrated circuit (PIC) connection technology using a revolutionary laser adhesion process. The intern will assist in designing and developing mechanical components for laser-based fiber-to-chip interconnect systems and support the fabrication and testing of mechanical prototypes.

Key focus areas include Assist in designing and developing mechanical components for laser-based fiber-to-chip interconnect systems, Create 3D models and technical drawings using CAD software, and Support the fabrication and testing of mechanical prototypes.

Successful candidates bring Bachelor's In Mechanical Engineering Or Related Field. Important skills include Precision Alignment Techniques, Clean Room Protocols, CAD Software, Problem-Solving, Analytical Skills, and Communication. Preferred (not required): ANSYS, Photonics, and Semiconductor Technologies.

Skills & qualifications

RequiredNice to have

Skills

Precision Alignment TechniquesClean Room ProtocolsCAD SoftwareProblem-SolvingAnalytical SkillsCommunicationCollaborationIndependent WorkSolidWorksANSYSPhotonicsSemiconductor TechnologiesLaser SystemsOptical Components

Qualifications

US Export Control Laws and Regulations EligibilityUS CitizenLawful Permanent ResidentAsylum or Refugee StatusBachelor's in Mechanical Engineering or Related FieldStrong Academic RecordRelevant Coursework in Mechanical Design Principles

Full job description

< Back Mechanical Engineer Rochester, NY, USA

Job Type

Full Time

Overview Photonect is seeking a talented Mechanical Engineering Intern to join our innovative team developing next-generation optical fiber to photonic integrated circuit (PIC) connection technology using our revolutionary laser adhesion process.

Role Description

  • Assist in designing and developing mechanical components for our laser-based fiber-to-chip interconnect systems

  • Create 3D models and technical drawings using CAD software (preferably SolidWorks)

  • Support the fabrication and testing of mechanical prototypes

  • Conduct research and perform engineering analyses to improve our interconnect technology

  • Collaborate with cross-functional teams, including optical and electrical engineers

  • Document engineering processes and prepare technical reports

Due to the nature of our work and its association with U.S. government-funded research, applicants must comply with U.S. export control laws and regulations. This includes eligibility under the International Traffic in Arms Regulations (ITAR) and the Export Administration Regulations (EAR). Candidates must be U.S. citizens, lawful permanent residents, individuals granted asylum or refugee status, or otherwise authorized to access controlled technology as defined by U.S. law.

Requirements Familiarity with precision alignment techniques and equipment

Knowledge of clean room protocols and practices

Experience with finite element analysis software (e.g., ANSYS)

Interest in photonics and semiconductor technologies

Qualifications

  • Currently pursuing a bachelor's degree in Mechanical Engineering or a related field

  • Strong academic record with relevant coursework in mechanical design principles

  • Proficiency in CAD software, preferably SolidWorks

  • Basic understanding of laser systems and optical components

  • Excellent problem-solving and analytical skills

  • Strong written and verbal communication abilities

  • Ability to work both independently and in a team environment

Join our team and be part of the next generation of high-performance, energy-efficient optical communication systems. Apply now to start your internship in Summer 2025. Send an email to [email protected] .

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