ASIC III – AMZ010066

Description

MULTIPLE POSITIONS AVAILABLE

Employer: Annapurna Labs (U.S.) Inc.

Offered Position: ASIC III – AMZ010066

Job Location: 11815 Alterra Pkwy, Austin, TX 78727

Job Number: AMZ010066

Position Responsibilities:

Design and validate high-bandwidth memory and DDR memory physical layer interfaces for machine learning accelerator chips and system-on-chip architectures. Integrate third-party intellectual property blocks into complex system-on-chip designs and perform advanced 2.5D packaging design for memory subsystems. Perform post-silicon validation and characterization of memory subsystems including bring-up, debug, and performance optimization. Define and implement boot-up initialization sequences, reset flows, and training algorithms for memory controllers and physical layer circuits. Collaborate with physical design teams to define timing constraints and review clock distribution networks for memory interfaces. Perform advanced system-level debugging and root-cause analysis of complex functional and performance issues through bring-up, characterization, validation, and production phases. Collaborate with third-party intellectual property vendors and memory device manufacturers to resolve technical issues and optimize performance parameters. Drive cross-functional technical teams to resolve complex functional and performance issues in production environments.

Basic Qualifications

Position Requirements:

Master’s degree or foreign equivalent in Electrical Engineering, Computer Engineering, or related field and seven (7) years of experience in the job offered or related occupation. Employer will accept a Bachelor’s degree or foreign equivalent in Electrical Engineering, Computer Engineering, or related field and nine (9) years of experience in the job offered or related occupation as equivalent to the Master’s degree and seven (7) years of experience. Must have seven (7) years of experience with: silicon development. Must have three (3) years of experience with system-on-chip, input/output subsystems, or memory interface design. Must have experience with: DDR and HBM memory protocols at physical layer and controller level including JEDEC specifications; DDR and HBM training algorithms, timing parameters, and controller configuration features; intellectual property integration and advanced silicon design methodologies; leading cross-functional technical teams to resolve complex functional and performance issues; post-silicon bring-up and validation of input/output and memory interface circuits; and working with third-party intellectual property vendors and memory device manufacturers.

Amazon.com is an Equal Opportunity-Affirmative Action Employer – Minority / Female / Disability / Veteran / Gender Identity / Sexual Orientation.

40 hours/week, 8:00am – 5:00pm, Salary Range $202,779 - $215,300 / year.

Amazon is a total compensation company. Dependent on the position offered, equity, sign-on payments, and other forms of compensation may be provided as part of a total compensation package, in addition to a full range of medical, financial, and/or other benefits. For more information visit: https://www.aboutamazon.com/workplace/employee-benefits.

Preferred Qualifications

Please see job description and position requirements above.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.