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ASIC Package Design Engineer

Broadcom

Austin, TXFull-time$144–230K/yrSeen 5 days agoSeen in employer's feed 5 days ago

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At a glance

Compensation
$144–230K/yr
Location
Austin, TX
Schedule
Full-time
Work Authorization
Not specified

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Job overview

Broadcom seeks an experienced IC package-design engineer to develop complex flip-chip-BGA packages for high-performance ASICs. The role supports designs for AI, networking, HPC, and 5G, including high-speed SerDes, HBM, and DDR5. The engineer collaborates with a worldwide R&D team, takes responsibility for package design and physical layout, and contributes to design-team efficiency improvements. The position is on-site five days a week.

Skills & qualifications

RequiredNice to have

Skills

Flip-Chip BGA Package DesignHigh-Speed SerDesSignal IntegrityPower IntegrityCadence APDCadence SKILLDesign Automation CodingSelf-ManagementOrganizationTeam Collaboration

Qualifications

BSEE or MSEE or Similar FieldBSEE+12 or MSEE+10 Years1+ Years Cadence SKILL Experience

Benefits

Medical Insurance
Dental Insurance
Vision Insurance
401(k) Match
Paid Time Off
Parental Leave

Full job description

USA-CA San Jose Innovation Drive

USA-TX-Austin - River Place B7

USA-Colorado-Fort Collins-4380 Ziegler Road

Full time

R027439

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Job Description:

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 448G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.

RESPONSIBILITIES:

  • Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.

  • Package Design of critical structures for SerDes, ADC/DAC, DDR, HBM, etc.

  • Schedule, prioritize, and track your work across 2+ projects simultaneously

  • General flip-chip BGA package design and engineering

  • Project management and customer interface for your design projects

  • Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc.

  • Physical design (layout) is a foundational responsibility in this role

EDUCATION/EXPERIENCE & REQUIREMENTS:

  • BSEE or similar field and 12+ years’ experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 10+ years’ work experience

  • Knowledge of package-level signal integrity and power integrity, to apply to package designs

  • Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.

  • Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers

  • Self-management and organization skills

  • Preferred candidates will also have 1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest

OTHER REQUIREMENTS

  • This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position.

Compensation and Benefits

The annual base salary range for this position is USD 143,800.00 To USD 230,000.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom!

We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

For more information please visit our video library (http://www.broadcom.com/videos) and check out our Connected by Broadcom (https://www.broadcom.com/support/resources/video-webinar-library?channel=5c9658f7c1d34eca91c6cc16178e5b1b&video=7d72b04ea50046a394e682fab640ce20) series.

Follow us on Linked In Broadcom Inc (https://www.linkedin.com/company/broadcom) .

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