
Senior Radio Frequency Engineer (Contingent)
Oklahoma City, OKContract$135–150K/yrSeen todaySeen in employer's feed today
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Requirements
Credentials this posting asks for.
Job overview
The Senior Radio Frequency Engineer will lead redesign of high‑power amplifier circuit cards, plan and execute measurements, develop RF and thermal simulation models, author requirements, manage EMI/EMC planning, coordinate vendor surveys, collaborate with program management, mentor team members, and perform other duties as assigned, contingent on contract award.
Skills & qualifications
Skills
Qualifications
Benefits
Full job description
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Lead High Power Amplifier Circuit Card Assembly redesign to achieve strict Form‑Fit‑Function‑Interface compatibility
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Plan and execute measurements of GFP/GFI hardware; derive and verify baseline parameters (gain/flatness, impedance/VSWR, output power, spectral purity, pulse shape/timing)
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Develop correlated RF and thermal simulation models; evaluate device topologies (BJT/LDMOS/GaN) and output combining networks
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Author and maintain requirements in MBSE; produce SSS and ICS with full traceability to sources and verification methods
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Own EMI/EMC and environmental planning; define fixtures and pre‑qualification per applicable standards
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Prepare and lead SRR/PDR with Government stakeholders; capture minutes, actions, and update RAID log
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Coordinate U.S. vendor market survey; manage NDAs; integrate supplier inputs on risks, manufacturability, and prototype ROM
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Collaborate with program management to maintain PMP and IMS; report status, risks, and mitigations
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Mentor team members; uphold engineering rigor and documentation quality
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Other duties as assigned
This position is contingent upon contract award.
Requirements
Education/Training:
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Bachelor’s Degree in relevant engineering or science discipline required
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Master’s degree preferred
Experience:
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8+ years experience designing, testing, and qualifying RF power amplifiers for radar or high‑power pulsed applications (L‑band preferred)
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Hands‑on experience with BJT/LDMOS/GaN device selection, biasing, matching networks, and microstrip layout
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Proficiency building high‑fidelity RF and thermal models (e.g., Ansys HFSS/Icepak) and correlating to measured data
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Requirements engineering using MBSE tools (e.g., Cameo)
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Authoring System/Subsystem Specifications and Interface Control Specifications
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EMI/EMC planning and pre‑qualification per MIL‑STD‑461; environmental and ESS testing per MIL‑STD‑810
Security:
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Must be a US citizen
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If selected candidate does not have an active Clearance at level Secret or higher, one will be obtained upon hire
Physical Requirements:
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Able to occasionally reach with hands and arms
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Prolonged periods of computer screen use, while sitting or standing at a desk
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Adhere to safety protocols when in work areas requiring use of PPE (e.g. eyewear, gloves, masks, hearing protection, steel toed shoes, etc.)
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Able to safely lift and carry up to 20 pounds at a time
Benefits
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Health Care Plan (Medical, Dental & Vision)
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Retirement Plan (401k, IRA)
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Life Insurance (Basic, Voluntary & AD&D)
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Paid Time Off (Vacation, Sick & Public Holidays)
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Short Term & Long Term Disability
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Training & Development
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Wellness Resources
Salary: $135,000 - $150,000
Salary rates for this position are competitive and commensurate with experience and industry standards. We offer a comprehensive benefits package that may include health insurance, paid time off, and retirement savings options.
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