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Manufacturing Technical Program Manager

Attotude

Menlo Park, CAJob$150–220K/yrPosted 8mo agoStill listed 3 days ago

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At a glance

Compensation
$150–220K/yr
Location
Menlo Park, CA
Work Authorization
Not specified

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Requirements

Credentials this posting asks for.

Bachelor's degree

Job overview

The Manufacturing Technical Program Manager leads development, industrialization, and execution of advanced manufacturing technologies, overseeing wafer fabrication, wire solutions, and precision assembly to transition innovations from development to high‑volume production in data‑center hardware platforms.

Skills & qualifications

RequiredNice to have

Skills

Wafer FabricationLithographyDepositionEtchCMPMetrologyYield OptimizationStatistical Process ControlRoot Cause AnalysisTechnical Program ManagementCross‑Functional Communication

Qualifications

Bachelor’s Degree in Engineering8+ Years ExperienceProven Experience Leading Wafer‑Level Products Through Production RampAbility to Manage Complex Technical Programs Across Multiple Teams and SitesExperience Working Directly With Wafer Fabs, OSATs, and External Manufacturing PartnersHands‑on Experience With Silicon Wafer Fab ProcessesExperience With Advanced Packaging or InterposersFamiliarity With High‑Performance InterconnectsExperience Supporting Datacenter, HPC, or Performance‑Critical HardwareMaster’s Preferred

Full job description

About AttoTude, The World's First THz Radio Over Wire

AttoTude is at the forefront of revolutionizing data centers through advanced interconnect technology based on wired THz transceivers. By adapting the fiber from photonics and advancing today's ASICs to THz, our innovative AttoEngine eliminates networking bottlenecks, enabling high-speed interconnects for AI data centers.

Job Summary

The Manufacturing Technical Program Manager (MFG TPM) leads the development, industrialization, and execution of advanced manufacturing technologies spanning wafer fabrication, innovative wire solutions, and precision alignment/assembly processes. The role owns technical program strategy, readiness milestones, and execution cadence to mature new technologies from early development through high-volume production.

Serving as a technical bridge across R&D, wafer fabs, OSATs, Manufacturing Engineering, and CMs, the MFG TPM ensures alignment between design intent, process capability, yield, and manufacturing readiness across globally distributed teams. The role combines strong wafer-fab technical understanding with disciplined program leadership and hands-on problem solving to support advanced datacenter hardware platforms.

Key Responsibilities

  • Own end-to-end technical execution of NPI programs from technology development through production ramp.

  • Drive concurrent development with R&D, aligning device architecture, process flows, and manufacturing strategy.

  • Lead wafer fabrication industrialization, including lithography, deposition, etch, CMP, metrology, and yield ramp.

  • Define and manage technology readiness milestones, build gates, and technical risk mitigation.

  • Act as the primary technical integrator and escalation point across fabs, OSATs, Manufacturing Engineering, and CMs.

  • Transition technologies from pilot builds into high-volume fab and manufacturing environments.

  • Establish yield learning, SPC, and control strategies and lead root cause resolution for process and reliability issues.

  • Own technical change control and ensure clear, consistent communication across sites and partners.

Required Qualifications

  • Bachelor’s degree in Engineering or related discipline (Master’s preferred).

  • 8+ years of experience in technology development, wafer fabrication, or advanced manufacturing NPI.

  • Proven experience leading wafer-level or semiconductor-based products through production ramp.

  • Ability to manage complex technical programs across multiple teams, sites, and manufacturing partners.

  • Experience working directly with wafer fabs, OSATs, and external manufacturing partners.

Preferred Qualifications

  • Hands-on experience with silicon wafer fab processes (lithography, etch, deposition, CMP, metrology).

  • Experience with advanced packaging or interposers.

  • Familiarity with high-performance interconnects (wires, cables, connectors).

  • Experience supporting datacenter, HPC, or performance-critical hardware.

Key Competencies

  • Technology development and industrialization

  • Wafer fab and process integration

  • Technical program ownership

  • Cross-functional and cross-site communication

  • Yield, reliability, and manufacturability optimization

AttoTude is an equal opportunity employer. We’re committed to building a diverse and inclusive workplace and providing equal employment opportunities to all applicants and employees. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity or expression, national origin, age, disability, veteran status, or any other legally protected characteristic. Annual Salary Range $150,000—$220,000 USD

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