Director, Laser Technology
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At a glance
Requirements
Credentials this posting asks for.
Job overview
The company seeks an experienced leader to own the end‑to‑end lifecycle of high‑power laser technology, guiding R&D, beam delivery modeling, and scaling laser‑material processing on the manufacturing floor while managing a multidisciplinary optics team.
Skills & qualifications
Skills
Qualifications
Full job description
We are seeking an experienced, seasoned leader of Laser Technology to lead our laser process development and advanced optics team. In this role, you will own the end-to-end lifecycle of our high-power laser technology —from initial optical physics R&D and beam delivery modeling to scaling laser-material processing loops on the manufacturing floor. You will manage a team of laser engineers, optical physicists, and process specialists driving breakthrough yields in precision material processing.
Key Responsibilities
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Own the technical roadmap for high-power laser systems, beam shaping optics, and ultrafast laser slicing for diamond wafers.
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Lead and scale a high-performing team of photonics engineers, optical physicists, and laser process specialists.
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Drive the scaling and transfer of laser-material processing recipes (dicing, singulation, surface ablation) from R&D to the factory floor.
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Partner with Equipment Engineering to design, procure, and integrate high-precision optical delivery hardware and galvo systems.
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Maximize diamond wafer yield by resolving complex laser-material interaction excursions, thermal lens effects, and beam drift
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Collaborate with Metrology and Automation teams to implement real-time optical sensor grids and closed-loop process controls.
Qualifications & Experience
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Master’s or Ph.D. in Optics, Photonics, Physics, Electrical Engineering, or Materials Science.
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8+ years in laser systems engineering, with 5+ years managing technical optical/process engineering teams.
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Deep technical expertise in high-power industrial lasers (fiber, DPSS, ultrafast/femtosecond), beam delivery optics, and galvo scanners.
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Proven track record in precision laser-material processing loops (e.g., semiconductor wafer slicing, ceramic/hard-material dicing, or optical annealing).
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Proficiency with optical simulation tools (Zemax, Code V) and multiphysics modeling platforms (COMSOL, MATLAB, Python).
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Strong background in Statistical Process Control (SPC), Design of Experiments (DOE), and Root Cause Analysis (RCA).
195000 - 270000 USD a year
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