Physical Failure Analysis Engineer

Job Description

We are seeking a hands-on Physical Failure Analysis Engineer to support laboratory-based failure analysis of complex hardware and materials. This individual will be responsible for performing physical characterization, imaging, and root-cause analysis using advanced techniques including CT, 2D/3D X-ray, SEM, FIB-SEM, optical microscopy, and cross-section analysis. This is a highly hands-on lab role rather than a research-focused position. The ideal candidate has a strong background in materials science, materials engineering, mechanical engineering, or failure analysis and is comfortable independently operating laboratory equipment, analyzing results, and communicating findings to cross-functional engineering teams. Key Responsibilities

• Perform hands-on physical failure analysis and materials characterization on components, assemblies, and hardware.
• Conduct CT and X-ray imaging, including 2D X-ray and 3D computed tomography/tomography.
• Perform SEM and FIB-SEM analysis to investigate material, structural, and component-level failures.
• Conduct optical microscopy for inspection, characterization, and failure analysis.
• Perform cross-sectioning and imaging to support root-cause investigations.
• Utilize techniques such as FTIR and other materials characterization methods as appropriate.
• Support acoustic/sonoscan microscopy where applicable.
• Perform or support thermal/materials analysis techniques such as DMA and TSC.
• Interpret imaging and characterization data to identify potential failure mechanisms and root causes.
• Document methodologies, findings, images, and conclusions in clear technical reports.
• Partner with engineering teams to communicate findings and support resolution of hardware and materials issues.
• Maintain laboratory equipment, procedures, and safe lab practices.

Skills and Requirements

• Master’s or PhD in Materials Science, Materials Engineering, Mechanical Engineering, or a closely related technical discipline.

• Minimum 3 years of hands-on laboratory experience.

• Strong hands-on experience with optical microscopy.

• Demonstrated experience with several advanced physical failure-analysis techniques, including: o CT / computed tomography o 2D and/or 3D X-ray imaging o SEM o FIB-SEM o Cross-section imaging and analysis

• Strong understanding of physical failure-analysis methodologies and root-cause investigation.

• Comfortable in an execution-oriented lab environment rather than a primarily academic or research-focused role.

• PhD with significant hands-on lab experience.

• Experience with FTIR.

• Experience with acoustic microscopy / Sonoscan.

• Experience with thermal or mechanical characterization techniques, including DMA, TSC, or related methods.

• Background supporting consumer electronics, hardware products, or high-volume electronic devices.

• Exposure to electrical failure-analysis techniques is a plus.

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal employment opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment without regard to race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request to [email protected].