Packaging Engineer

Change the world. Love your job.

As a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the Package Technology Solutions organization.

Responsibilities include:

• Develop and enhance substrates, mold compound, and other packaging materials for power devices with focus on datacenter and automotive applications

• Collaborate with product lines, AT sites, and suppliers to define package requirements and roadmaps for power devices

• Co-design and qualify new power packages and capabilities with various product groups

• Perform packaging tradeoffs between system performance, package design, cost, manufacturability, and reliability

• Utilize thermal and mechanical modeling to aid in package technology choice and design tradeoffs

• Coordinate the introduction of new package processes into production at internal/external AT sites

• Prepare and/or update specifications for piece parts of integrated circuits or semiconductor assemblies Qualifications

• Work with failure analysis team to improve designs and processes

Why TI?

• The future starts here. As a TIer, you'll play a critical role in defining the next era of semiconductor technology and help create the innovations that shape the world around us.

• Surround yourself with a team of innovators who value your unique perspective and will challenge you to bring your best self to work every day. We believe that fostering a culture of collaboration fuels both personal growth and technological breakthroughs. Explore our company culture (https://careers.ti.com/en/sites/CX/pages/our-culture) .

• At TI, your success goes beyond your work. Take advantage of comprehensive benefits designed to support your total well-being at work and in life, from competitive compensation to extensive health coverage and wellness programs. Learn more about our benefits offerings (https://careers.ti.com/en/sites/CX/pages/benefits) .

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com .

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws.

If you are interested in this position, please apply to this requisition.

Minimum requirements:

• Bachelor's degree in Electrical Engineering, Materials Engineering, Mechanical Engineering or related Engineering field of study

• 5+ years of experience working as an Engineer on projects with substantial packaging activities

Preferred qualifications:

• Ability to perform packaging tradeoffs between system performance, package design, cost, manufacturability, and reliability

• Ability to design packages with emphasis on power efficiency

• Understanding of inductor design and manufacturing

• Ability to work with assembly sites to ramp new processes

• Understand of manufacturing impact on quality

• Understanding of best practice to ensure supplier quality

ECL/GTC Required: Yes