Senior/Principal TCAD Engineer

Develop and own TCAD modeling frameworks for advanced devices and interfaces relevant to 3DHI, including hybrid bonding contacts, TSVs, BEOL interconnects, and emerging device structures.Perform multi-physics simulations (electrical, thermal, mechanical, and reliability) to predict performance, variability, and failure mechanisms across stacked, heterogeneous die systems.Co-optimize devices, interconnect, and packaging designs by working closely with process integration, packaging, and circuit teams to close the loop between fabrication, measurement, and simulation.Calibrate and validate TCAD models using silicon data from wafer-level test vehicles and process monitors; drive model-to-hardware correlation across corners and stress conditions.Define simulation methodologies and best practices for 3D device and interface modeling (e.g., contact resistance, current crowding, electromigration, thermo-mechanical stress).Engage with foundry, EDA, and materials partners to influence next-generation TCAD tool features and process design enablement for 3D-stacked systems.Author technical documentation, modeling guidelines, and reference flows to support ecosystem adoption of TIEs device and interface platforms.Mentor junior engineers and technical staff, setting standards for modeling rigor and engineering judgment across the organization.