Intern - Process Integration – Advanced Packaging

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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Department Introduction

Micron’s Wafer Level Packaging Technologies Team is at the forefront of developing advanced interconnect and packaging solutions that enable next-generation memory technologies. Based in Boise, Idaho, the team collaborates across engineering fields to define technology requirements, build program plans, and drive innovation in process integration.

Position Overview

As an Advanced Package TD Process Integration Intern, you will work alongside experienced engineers to support the development of sophisticated interconnect technologies. This internship offers hands-on experience in problem-solving, experimental design, line monitoring, and data analysis, contributing directly to yield improvement and process optimization.

Responsibilities

• Lead problem-solving activities using structured methodologies such as Kepner-Tregoe (KT)

• Define and implement Design of Experiments (DoE) for process development

• Communicate findings across local and global teams and present results to partners

• Support line monitoring through project management and yield improvement initiatives

• Develop new line monitoring methods and define critical metrics

• Conduct experimental work using Micron systems and document outcomes

• Analyze experimental results and provide clear, actionable recommendations

• Proficient in the use of AI tools, workflows and agents to maximize learning.

Minimum Qualifications

• Currently enrolled in an accredited university with expected graduation no earlier than Fall 2026

• Excellent data extraction, analysis, and reporting skills (e.g., JMP, system analytics)

• Strong collaboration and communication skills across multi-functional teams

• Ability to prioritize multiple complex tasks and adapt to changing responsibilities

• Initiative and flexibility to take on added responsibilities

• Tenacity to work under tight timelines and limited resources

Preferred Qualifications

• Experience with semiconductor process integration or packaging technologies

• Familiarity with structured problem-solving and decision-making frameworks

• Exposure to experimental design and statistical analysis tools

• Interest in advanced packaging and interconnect development

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [email protected] or 1-800-336-8918 (select option #3)

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