Packaging Integration Engineer (2027 New College Graduate)

About GlobalFoundries GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for high-growth markets. GF is a trusted and holistic technology partner for customers around the world. GF's talented, global team remains focused every day on security, longevity, and sustainability. For more information, visit www.gf.com. New College Graduates Overview: We offer many full-time employment paths for recent graduates, which provide accelerated training in a fast-paced work environment, cross-functional working opportunities, and talent mobility. New college graduates are provided with mentorship, networking, and leadership opportunities, which give our new team members life-long connections and skills. Summary of Role: GlobalFoundries (GF) is seeking a new college graduate to support the development of industry-leading electro-optical transceivers using GF's Photonix platform and advanced 2.5D and 3D co-packaged optics form factors. This hands-on role will contribute to thermal, mechanical, electrical, and optical chip-package co-design, with an emphasis on product and module performance, reliability, packaging design rules, materials selection, and electrical, photonic, and thermal requirements for chiplet and product modules. Essential Responsibilities include: Support Silicon Photonics advanced packaging innovation and customer design enablement by contributing to packaging design rules, product requirements, and efficient manufacturing processes with internal teams and OSAT ecosystem partners. Participate in cross-functional design reviews and use engineering analysis to help resolve technical, manufacturability, reliability, and yield concerns for new customer products. Develop and apply analysis or simulation models to evaluate package performance, manufacturability, cost, and quality, and document findings and recommendations for engineering stakeholders. Contribute to qualification robustness and continuous improvement plans by applying consistent design processes, tracking requirements, and supporting product development from concept through production readiness. Other Responsibilities: Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. Required Qualifications: Education - Graduating with Bachelor's or Master's in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering or related field from an accredited degree program. Must have at least an overall 3.0 GPA and proven good academic standing. Language Fluency - English (Written & Verbal) Travel - Up to 10% Preferred Qualifications: Prior related internship or co-op experience. Demonstrated prior leadership experience in the workplace, school projects, competitions, etc. Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making. Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity. Strong written and verbal communication skills Strong planning & organizational skills Coursework, research, internship, or project experience in advanced packaging, chip-package co-design, photonics, thermal or mechanical analysis, materials, reliability, or packaging process integration. #NCGProgramUS Expected Salary Range $58,400.00 - $100,800.00 The exact Salary will be determined based on qualifications, experience and location. If you need a reasonable accommodation for any part of the employment process, please contact us by email at [email protected] and let us know the nature of your request and your contact information. Requests for accommodation will be considered o a case-by-c