
3D Heterogeneous Integration Development Intern (Summer 2027)
Malta, NYFull-time$20–40/hrPosted 1mo agoStill listed today
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Job overview
The 3D Heterogeneous Integration Development Intern will contribute to advanced packaging and process-integration development, including hybrid bonding, TSV/TOV, and interposer technologies. The intern will conduct experiments, analyze technical data, model processes, and support integration and process-development activities with engineering teams. The role is intended for a student pursuing an engineering or related degree and includes mentorship, professional development, and project collaboration.
Skills & qualifications
Skills
Qualifications
Full job description
About GlobalFoundries GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for high-growth markets. GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, visit www.gf.com.
Internship Program Overview: Our Interns & Co-ops are our entry-level talent pipeline for GF across the globe. Our goal is to provide students with a meaningful work experience that will equip them with the skills to embark on a career in the fast-paced and growing semiconductor industry after graduation. As an intern at GF, you’ll experience one-on-one mentorship, work assignments that prioritize your growth and potential, professional development opportunities, and the chance to network with executives.
Summary of Role: The 3D Heterogeneous Integration Development Intern will contribute to advanced packaging and process-integration development, including wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, through-silicon via/through-oxide via (TSV/TOV), and interposer technologies. The intern will work with engineering teams to conduct experiments, analyze technical data, model processes, and support daily integration and process-development activities.
Essential Responsibilities include:
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Plan and perform design of experiments (DOEs) using internal semiconductor tooling and equipment at external partners.
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Analyze and interpret engineering data from experiments, process optimizations, and characterization activities.
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Develop or support process models to improve understanding of advanced packaging and integration performance.
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Assist engineers with daily integration, process-development, documentation, and technical problem-solving activities.
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Collaborate with process, materials, equipment, characterization, and external partner teams to support project objectives.
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Summarize experimental results and communicate technical findings and recommended next steps to project stakeholders.
Other Responsibilities:
- Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Required Qualifications:
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Education – At least a sophomore at time of application and actively pursuing a Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or related field through an accredited degree program during the time of internship.
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Must have at least an overall 3.0 GPA and be in good academic standing.
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Language Fluency - English (Written & Verbal)
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Travel - Up to 10%
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Ability to work at least 40 hours per week during the internship.
Preferred Qualifications:
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Prior related internship or co-op experience
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Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
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Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.
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Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
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Strong written and verbal communication skills
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Strong planning & organizational skills
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Currently pursuing a PhD in Engineering or related field through an accredited degree program during the internship
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Experience with advanced semiconductor packaging, semiconductor integration, hybrid bonding, TSV/TOV, interposers, design of experiments, or engineering data analysis
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Availability for a six-month co-op assignment is preferred
#InternshipProgramUS
Expected Salary Range $20.00 - $40.00
Expected Salary Range $0.00 - $0.00 The exact Salary will be determined based on qualifications, experience and location.
If you need a reasonable accommodation for any part of the employment process, please contact us by email at [email protected] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.
An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.
GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.
All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law
How this job compares
Set against the 2,067 open Engineering Intern jobs on Olive Jobs, counted November 10, 2026.
- Pay
- This posting$20–40/hr
- New York median$22–27/hr86 hourly ranges
- US median$23–30/hr1,125 hourly ranges
This range's midpoint, $30/hr, is 21% above the New York median midpoint ($25/hr) — in the middle half of Engineering Intern hourly ranges in New York.
- Openings
- Olive Jobs lists 151 open Engineering Intern jobs in New York and 2,067 across the US. Under 1% of them nationwide are listed as remote or flexible.
- Hiring the most in New York
- TTM TECHNOLOGIES, INC.12 open
- Constellation11 open
- Central Hudson Gas & Electric Corporation10 open
- Experience
- Engineering Intern postings that state a minimum ask for 0 years of experience at the median; the middle half ask for 0 to 1 year (33 postings).
- Education
- 694 of the 2,067 open Engineering Intern jobs (34%) ask for a bachelor's degree or higher.
Counted across the open, public US postings on Olive Jobs on November 10, 2026. Pay medians are the middle values of the low ends and of the high ends of postings that list both ends of a range in the same cadence (a yearly salary or an hourly rate); a range's midpoint is halfway between its ends. Pay and experience figures resting on fewer than 20 postings are left out.
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