
SOC Thermal Engineer
Austin, TXJobSeen 3w agoSeen in employer's feed 6 days ago
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Job overview
Apple seeks a self-motivated Thermal Engineer to optimize mobile-device thermal performance and contribute to advanced IC packaging research and development. The role designs and validates cooling solutions for high-performance computing systems through simulation, testing, and cross-functional collaboration. Candidates need a BS and 10 years of industry experience; an MSEE is preferred. The posting also seeks deep thermal-design expertise, semiconductor packaging knowledge, and proficiency with named industry tools.
Skills & qualifications
Skills
Qualifications
Full job description
Role Number: 200685791-0240
Summary
Do you love working on challenges that no one has yet solved? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device’s thermal performance and participate in advanced IC packaging research and development.
Description
The Thermal Engineer will design and validate cooling solutions for high-performance computing systems. The role involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines.
Minimum Qualifications
- BS + 10 years of industry experience.
Preferred Qualifications
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MSEE + 10 years of industry experience, preferred.
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Demonstrated leadership capabilities at the senior engineer level.
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Deep expertise in thermal design for silicon devices and packaging solutions.
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Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies.
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Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches.
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Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics.
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Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs.
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Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products
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Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk.
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Experience designing and executing experimental test setups and analyzing thermal data.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.
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