Quantum TSV Integration Engineer

GlobalFoundries Fab8 is seeking a highly skilled and motivated R&D TSV engineer to become part of our Quantum Advanced Packaging team. The primary responsibility of this position is to own development and integration of cryogenic, superconducting TSV technologies enabling high-density vertical interconnects for scalable quantum packaging from concept through manufacturing. About GlobalFoundries GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. Job Summary GlobalFoundries Fab8 is seeking a highly skilled and motivated R&D TSV engineer to become part of our Quantum Advanced Packaging team. The primary responsibility of this position is to own development and integration of cryogenic, superconducting TSV technologies enabling high-density vertical interconnects for scalable quantum packaging from concept through manufacturing. Essential Responsibilities Lead development of through-silicon via (TSV) processes for cryogenic and superconducting applications. Define TSV architectures including: Superconducting liners (e.g., Nb, Al-based) Dielectric isolation schemes Via geometries (diameter, depth, pitch) Ensure TSV designs are optimized for: Low-loss electrical/RF signal transport Cryogenic thermal and mechanical stability Own end-to-end TSV integration flows across: Via etch, liner deposition, dielectric, and metallization Wafer thinning, reveal, and backside processing Integration into 2.5D/3D packaging stacks Drive process integration planning to enable prototyping and qualification across programs. Develop TSV solutions for superconducting interposers and 3D integration platforms Support integration with: Bump/interconnect layers Redistribution routing layers (RDL) Assembly and bonding flows Ensure TSVs enable high-density vertical interconnects for quantum system scaling. Enable prototype builds and development lots, ensuring smooth execution through fab and assembly flows. Support transition from R&D to pilot to manufacturable flows. Collaborate with device/test teams to ensure TSVs meet: Cryogenic electrical performance requirements (DC + RF/microwave) Low resistance and minimal loss for superconducting operation Support characterization of: Signal integrity (noise, crosstalk) Thermal leakage across vias Develop strategies to improve: TSV yield and process robustness Integration reliability under cryogenic conditions Identify and analyze failure modes such as: Liner defects / discontinuities Delamination or cracking during thermal cycling Void formation or via integrity issues Lead root-cause analysis and corrective actions. Work closely with materials teams to: Select TSV liner and dielectric materials compatible with superconducting operation Understand cryogenic behavior (CTE mismatch, stress, superconductivity limits) Optimize interface integrity between via liner, dielectric, and substrate. Define requirements for TSV-specific process tools: Deep silicon etch (DRIE) Conformal deposition (PVD/CVD/ALD) Wafer thinning and reveal Collaborate with equipment vendors and suppliers to develop new capabilities. Support qualification of new tooling and materials. Interface across: Interconnect (bump / RDL) teams Assembly and integration engineers Device / qubit / system engineers Ensure co-optimization of TSVs with full packaging stack. Drive development of next-generation TSV scaling, including: Smaller diameters and higher aspect ratios Alignment with micro-bump pitch scaling Contribute to cryogenic 3DHI roadmap and APPC capability build-out. Evaluate novel via concepts (e.g., superconducting-lined, partially filled, or air-ga vias). Gene