Radio Frequency (RF) Architect

Architect RF and mixed-signal microsystems operating across K-band (1827 GHz), Ka-band (2740 GHz), and W-band (75110 GHz) for high-performance, low-latency communication, radar, and sensing applications.Define and drive RF front-end architectures, including LNAs, PAs, mixers, phase shifters, and T/R modules, optimized for 3.0D integration and advanced packaging flows.Collaborate with device, packaging, and digital architects to achieve co-optimization of RF, thermal, and mechanical performance within heterogeneous multi-die systems.Lead EM/circuit co-simulation and system-level modeling using tools such as HFSS, ADS, AWR, or CST to validate and tune design performance across process corners and temperature.Oversee RF testing, characterization, and calibration at wafer, die, and module levelsdeveloping test plans, de-embedding strategies, and measurement automation for K/W-band hardware.Engage with foundry, EDA, and metrology partners to define design enablement requirements for next-generation RF packaging (e.g., hybrid bonding, AiP, glass/Si interposers).Author technical documentation, reference designs, and design guidelines to accelerate ecosystem adoption of TIEs 3.0D RF microsystems platform.Other related functions as assigned.