Senior Project Manager for ChiptoPackage Interaction (CPI) Qualifications

About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. Summary of Role: To further strengthen our Chip-to-Package Interaction (CPI) team, we are seeking an experienced and highly motivated Senior Qualification Project Manager with a strong background in semiconductor technology development, project management, post-fab technologies (bumping, assembly, and package-level testing), BEOL integration fundamentals, and reliability qualification methodologies. In this role, you will lead CPI qualification programs from concept through qualification and technology release, working closely with global, cross-functional teams including technology development, design, reliability engineering, manufacturing, and external assembly and test partners (OSATs). You will play a key role in enabling next-generation semiconductor packaging solutions and advanced technology platforms. The position is based at GlobalFoundries' facility in Malta, New York. Essential Responsibilities: Lead end-to-end CPI qualification projects supporting Technology Development Programs, including: Define CPI qualification strategies, scope, deliverables, milestones, and success criteria in alignment with technology development objectives. Develop and maintain project plans, schedules, budgets, resource forecasts, and risk mitigation strategies to ensure successful program execution. Coordinate and lead cross-functional teams across Technology Development, Design, Reliability Engineering, Manufacturing, Quality, Supply Chain, and external partners. Support the selection and management of outsourced semiconductor assembly and test (OSAT) partners to ensure timely delivery of qualification objectives. Drive test vehicle planning, design definition, and qualification vehicle implementation in support of program requirements. Define reliability qualification plans, test structures, characterization requirements, and data collection strategies to assess CPI performance and robustness. Track project progress, qualification metrics, reliability results, budgets, and schedules, ensuring achievement of technical, quality, cost, and timeline objectives. Proactively identify, assess, and mitigate project risks, technical challenges, and schedule impacts, and drive appropriate escalation and resolution. Lead technical and program reviews, facilitate cross-functional decision-making, and ensure alignment on qualification strategies and program priorities. Drive milestone readiness assessments and lead qualification reviews to support technology and product release decisions. Support customer engagements by communicating qualification strategies, project status, reliability results, and technology readiness. Prepare and present project updates, technical recommendations, risk assessments, and executive summaries to management, customers, and external stakeholders. Establish effective communication and collaboration across global teams and partner organizations to ensure successful project execution. Other Responsibilities: Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. Required Qualifications: Bachelor's or Master's degree in Electrical Engineering, Materials Science, Physics, or a related technical discipline. Minimum of 5 years of experience in the semiconductor industry, with a background in technology development, packaging, assembly, reliability engineering, qualification, or related areas. Proven success leading complex, cross-functional technical projects from concept thr ugh