R&D Scientist - High Performance Computing Materials

Job Summary We are seeking an accomplished R&D Scientist to lead Avient's innovation in next-generation thermoplastic materials for High Performance Computing (HPC), AI infrastructure, and hyperscale data center applications. This technical leader will develop advanced low dielectric constant and ultra-low dielectric loss materials for high-speed connector systems operating at increasingly demanding data rates. The successful candidate will combine expertise in materials science, electrical performance, device physics, and advanced characterization to accelerate commercialization of breakthrough materials for next-generation computing architectures. The ideal candidate will have deep knowledge of the relationship among material structure, processing, characterization of electrical performance for complex form-factors, with experience supporting high-speed connectors, semiconductor packaging, advanced interconnects, data communications, RF systems, or other signal integrity-critical technologies. As part of Avient's Corporate Technology Innovation organization, this role will influence technology strategy, intellectual property development, customer engagement, and future growth platforms at the forefront of AI and digital infrastructure. Essential Functions Technical Leadership & Innovation - Lead development of next-generation thermoplastic materials for high-speed connector and interconnect applications in AI, cloud computing, networking, and hyperscale data centers. - Serve as the company's technical subject matter expert in dielectric materials, signal integrity, and material solutions for high-frequency electronics. - Develop material platforms with industry-leading dielectric constant (Dk), dissipation factor (Df), dimensional stability, thermal performance, processability, and reliability. - Identify emerging technology trends and establish roadmaps aligned with industry requirements for 224G, 448G, and next-generation data transmission architectures. - Expand Avient's intellectual property portfolio through invention disclosures, patents, and new technology platforms. Materials Development - Design and optimize thermoplastic formulations based on structure-property-performance relationships. - Evaluate high-performance polymers, including LCP, PPE, PPS, PEEK, fluoropolymers, polyimides, and other advanced dielectric materials. - Investigate novel fillers, reinforcements, additives, and processing methods to achieve ultra-low dielectric loss. - Establish material selection criteria and specifications that meet customer requirements for signal integrity, thermal management, reliability, and manufacturability. - Use advanced statistical methods, design of experiments (DOE), and data analytics to accelerate formulation optimization. Characterization & Testing - Develop and execute advanced methods to characterize electrical, thermal, mechanical, and morphological properties. - Correlate molecular structure, morphology, crystallinity, and interfacial interactions with high-frequency dielectric performance. - Lead testing and analysis using techniques such as: - Vector Network Analysis (VNA) - Dielectric spectroscopy - Time-domain reflectometry (TDR) - Differential scanning calorimetry (DSC) - Dynamic mechanical analysis (DMA) - Thermogravimetric analysis (TGA) - Microscopy and surface characterization techniques - Interpret material- and device-level performance data to guide formulation and design decisions. Customer & Market Engagement Partner with marketing and commercial teams to capture the voice of customers, including connector manufacturers, semiconductor