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Product Engineer I - II or Sr. Product Engineer, Texas Institute for Electronics

UNIVERSITY OF TEXAS AT AUSTIN

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At a glance

Compensation
No compensation found
Location
AUSTIN, TX
Work Authorization
Not specified

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Job overview

The Product Engineer will validate products and test vehicles, develop and optimize manufacturing and test workflows, and contribute to 2.5D and 3D advanced packaging solutions for semiconductor devices. The role supports TIE’s 3D-ADK, investigates process variation and yield and reliability issues, and owns product life-cycle activities from bring-up through customer qualification. It also involves collaboration with design teams and customers to address compatibility and field failures.

Skills & qualifications

RequiredNice to have

Skills

Product ValidationWorkflow Optimization2.5D/3D ModelingAdvanced Packaging3D-ADKFab MetrologyYield AnalysisSilicon Simulation CorrelationRoot-Cause AnalysisFailure AnalysisDesign of ExperimentsDFTDFMATE TestingBench ValidationData AnalyticsCustomer Collaboration

Full job description

Product and test vehicle validation to specifications, development and optimization of manufacturing/test workflows, 2.5D/3D modeling accuracies, creation of BKMs (Best Known Practices) to comprehend and optimize Power/Thermal/Mechanical/Signal Integrity/RF impacts of multi-chiplet and multi-domain heterogeneous micro-systems. Contribute to the design and development of 2.5D and 3D advanced packaging solutions for semiconductor devices. Develop and support TIE's 3D-ADK (Assembly Design Kit). Interpret fab metrology, defect, E-test yield, and evaluate silicon-to-simulation correlation accuracies to understand and quantify process variations and their impacts on performance, yield, and reliability. Drive corrective actions across cross-functional teams to fix and identify root-cause systematic yield and reliability issues. Perform Failure analysis on products manufactured at TIE Collaborate with internal and external design teams to ensure package compatibility with semiconductor die and system-level requirements. Design and execute appropriate DOEs Stay current with industry trends and emerging technologies in semiconductor packaging and design integration to drive innovation and continuous improvement. Define product DFT and DFM requirements and methodologies. Help with ATE Test plan definitions and requirements. Bench/lab validation and characterization of various IC solutions and test structures to understand multi-physics impacts of our 3DHI processes. Leverage data analytics to drive product yield and reliability optimization. Own entire product life cycle from bring up, performance/yield/reliability optimization, to customer qualification. Collaborate with customers to understand and resolve field failures.

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