Electro Mechanical Engineer Stf
Orlando, FLFull-time$105–195K/yrSeen 4 days agoSeen in employer's feed 4 days ago
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At a glance
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Job overview
The Electro Mechanical Engineer will design, prototype, and test advanced electronics packaging for aerospace and defense systems. The role focuses on 2D/3D heterogeneous packaging, thin-film interconnects, semiconductor dies, and thermal management, with work spanning design validation, failure analysis, documentation, and cross-functional integration. The engineer will also mentor junior engineers, support technology readiness reviews, and contribute to risk assessments. The position requires U.S. citizenship and the ability to obtain a secret clearance.
Skills & qualifications
Skills
Qualifications
Benefits
Full job description
Standard Job Description
You will be the Electro Mechanical Engineer for the Advanced Electronics Packaging team at Lockheed Martin Missiles & Fire Control. Our team pioneers 2 D/3 D heterogeneous packaging concepts, integrating thin film, semiconductor and high performance thermal management technologies to create next generation electronic systems for aerospace and defense missions.
What You Will Be Doing
As the Electro Mechanical Engineer you will design, prototype and test cutting edge packaging solutions while collaborating with electrical, systems, test and product design engineers. You will work side by side with Lockheed Martin’s senior Advanced Packaging SME, gaining hands on experience with emerging semiconductor manufacturing processes and translating them into flight qualified hardware. Your responsibilities will include:
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Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets.
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Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features.
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Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes.
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Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback.
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Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports.
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Collaborating with cross functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems.
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Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance.
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Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.
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Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts.
Why Join Us
Do you want to be part of a company culture that empowers employees to think big, lead with a growth mindset, and make the impossible a reality? We provide the resources and give you the flexibility to enable inspiration and focus. If you have the passion and courage to dream big, work hard, and have fun doing what you love then we want to build a better tomorrow with you.
We offer flexible work schedules to comprehensive benefits investing in your future and security. Learn more about Lockheed Martin’s comprehensive benefits package here. (https://lmt.co/OneLM-JobDescription-Benefits)
Further Information About This Opportunity:
This position is in Orlando, FL or Grand Prairie,TX. Discover more about our Orlando, Florida location. (https://lmt.co/MFC-JobDescription-Orlando) Discover more about our Dallas, Texas location.
MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a secret clearance.
Basic Qualifications
-Minimum 8 years of professional experience in Electromechanical Engineering or related discipline with a Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university
or Minimum 12 years of professional experience in Electromechanical Engineering or related discipline without a degree
-Microelectronics & Layout Design: Proven experience in microelectronics design, including Circuit Card Assembly (CCA) / Printed Wiring Board (PWB/PCB) design, and flex circuit design.
-Interconnect Engineering: Experience with cable harness concepts for subsystem interfaces and generating detailed functional wiring diagrams.
-High-Speed Systems: Familiarity with high-speed applications and associated PWB layout constraints.
-Requirements Management: Experience capturing, flowing down, and deriving technical requirements for complex electromechanical designs.
-Component Selection: Experience managing parts, materials, and process selections for electronic hardware
Desired Skills
-Advanced Packaging Architecture: Experience with System-on-Chip (SOC) / Multi-Chip Package (MCP) solutions and 2D/3D heterogeneous integration concepts.
-Validation & Test Integration: Familiarity with Application-Specific Integrated Circuit (ASIC) verification and validation testing requirements at the circuit card level.
-Trade Studies & Optimization: Demonstrated ability to perform comprehensive design trade studies evaluating cost, weight, thermal packaging, and power benefits.
-Systems Engineering Tools: Familiarity with Model-Based Systems Engineering (MBSE) methodologies and CAMEO software
Pay Information
Full-Time Salary Range: $104900.00 - $194700.00
At Lockheed Martin, we know mission success starts with taking care of our people. Our Total Rewards program is designed to attract top talent, support your well-being, and help you grow—both professionally and personally.
The salary range for this position is as listed on the requisition. Please note that the salary information listed is a general guideline only. Lockheed Martin considers factors such as (but not limited to) scope and responsibilities of the position, candidate's work experience, education/ training, key skills as well as market(work location) and business considerations when extending an offer.
Benefits offered: Medical, Dental, Vision, Flexible work arrangements and schedules (e.g., 4x10), 401(k) match, Paid time off, Holidays, Parental Leave, EAP, Flexible Spending Accounts, Education Assistance, Life Insurance, Short-Term Disability, and Long-Term Disability.
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Annual short-term and/or long-term incentive compensation programs may be offered depending on the position. Payments under these annual programs are not guaranteed and can vary from year to year and are tied to a range of performance metrics.
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For (Washington state applicants only) Non-represented full-time employees: accrue at least 10 hours per month of Paid Time Off (PTO) to be used for incidental absences and other reasons; receive at least 90 hours for holidays. Represented full time employees accrue 6.67 hours of Vacation per month; accrue up to 52 hours of sick leave annually; receive at least 96 hours for holidays. PTO, Vacation, sick leave, and holiday hours are prorated based on start date during the calendar year.
Lockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.
How this job compares
Set against the 969 open Hardware Engineering jobs on Olive Jobs, counted October 27, 2026.
- Pay
- This posting$105–195K/yr
- US median$146–240K/yr686 salary ranges
This range's midpoint, $150K, is 26% below the US median midpoint ($202K) — in the lowest quarter of Hardware Engineering salary ranges across the US.
- Openings
- Olive Jobs lists 17 open Hardware Engineering jobs in Florida and 969 across the US. Under 1% of them nationwide are listed as remote or flexible.
- Experience
- This posting asks for at least 8 years of experience; Hardware Engineering postings that state a minimum ask for 6 years at the median (659 postings).
- Education
- 355 of the 969 open Hardware Engineering jobs (37%) ask for a bachelor's degree or higher.
Counted across the open, public US postings on Olive Jobs on October 27, 2026. Pay medians are the middle values of the low ends and of the high ends of postings that list both ends of a range in the same cadence (a yearly salary or an hourly rate); a range's midpoint is halfway between its ends. Pay and experience figures resting on fewer than 20 postings are left out.
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