
R&D Process Development Engineer
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Job overview
The R&D Process Development Engineer develops, characterizes, optimizes, and scales advanced manufacturing processes for Semi-Additive Plating (SAP) build-up technology. The role spans mechanical processing, lithography, electroplating, and etching, bridging laboratory experiments and small-scale production equipment. The engineer evaluates and qualifies equipment and develops processes to achieve intended results. Semiconductor or Fan-Out Wafer Level Packaging experience is a plus.
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Full job description
JOB REQUIREMENTS: TTM Technologies, Inc. - Publicly Traded US Company, NASDAQ (TTMI) - Top-5 Global Printed Circuit Board Manufacturer About TTM TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency ("RF") components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards ("PCB"s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com TTM Technologies is a leading manufacturer of high-reliability printed circuit boards serving the aerospace, defense, medical device, telecommunications, automotive, and industrial electronics markets. Our manufacturing capabilities span rigid, flex, rigid-flex, HDI, RF/microwave, and advanced multilayer constructions. We are committed to pushing the boundaries of PCB technology through disciplined process development, continuous improvement, and an unwavering dedication to quality and customer satisfaction. POSITION SUMMARY The R&D Process Development Engineer is a highly technical individual contributor responsible for developing, characterizing, optimizing, and scaling advanced manufacturing processes associated with Semi-Additive Plating (SAP) build up technology. Familiarity with Semi-Conductor or Fan-Out Wafer Level Packaging FOWLP process techniques is a plus as line and space characteristics are approaching historic Integrated Circuit sizes. Need for R&D engineering across four critical PCB fabrication disciplines: Mechanical Processing, Lithography, Electroplating, and Etching. This role sits at the intersection of materials science, chemistry, precision engineering, and manufacturing - requiring both deep scientific rigor and practical manufacturing instincts. This individual is expected to be the recognized technical authority within their focus areas - able to think outside of the standard and come up with solutions to complex problems, evaluate and set up new equipment and derive processes around those tools to achieve intended results. This role requires someone equally comfortable running-controlled experiments in a laboratory and developing processes on small scale production manufacturing equipment- someone who bridges the gap between science and production with clarity, confidence, and technical credibility. KEY RESPONSIBILITIES Semi-Additive (SAP) Build-up Process Development Equipment definition, purchase, setup and qualification for R&D. Develop technology that can be scaled to provide solutions to customers... For full info follow application link. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability or protected veteran status. ***** APPLICATION INSTRUCTIONS: Apply Online: ipc.us/t/F31204F73C944542
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