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Engineering Technician / Micro-Electronic Wire Bonder Technician

Teledyne

Lewisburg, TNJobPosted 3mo agoSeen in employer's feed 5 days ago

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At a glance

Compensation
No compensation found
Location
Lewisburg, TN
Work Authorization
Not specified

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Job overview

Teledyne is hiring an Engineering Technician / Micro-Electronic Wire Bonder Technician. Teledyne Technologies Incorporated is seeking an Engineering Technician / Micro-Electronic Wire Bonder Technician to perform electronic, micro-electronic, and electro-mechanical assembly and technical support tasks. This role involves building and assembling units, performing precision micro-electronics work including wire bonding under a microscope, and supporting production and engineering by executing assembly processes and assisting with troubleshooting.

Key focus areas include Assemble electronic and electro-mechanical subassemblies following production drawings, work instructions, and engineering documentation, Perform precision micro-electronics assembly, including wire bonding operations using specialized bonding equipment under a microscope, and Interpret schematics, wiring diagrams, bills of material (BOMs), and manufacturing instructions to determine required components and processes.

Successful candidates bring High School Diploma. Important skills include Wire Bonding, Microscope Work, Fine Motor Skills, Electronic Components, Schematics, and Soldering.

Skills & qualifications

RequiredNice to have

Skills

Wire BondingMicroscope WorkFine Motor SkillsElectronic ComponentsSchematicsSolderingMicro-AssemblyAttention to DetailTroubleshootingManual DexterityHand-Eye CoordinationCollaborationESD ControlsIPC Standards

Qualifications

High School Diploma or Equivalent0-3 Years Electronic Assembly Experience0-3 Years Micro-Electronics Experience0-3 Years Wire Bonding ExperienceTechnical Training

Full job description

Be visionary

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.​

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Description

Under close to moderate supervision, performs a wide range of electronic, micro-electronic, and electro-mechanical assembly and technical support tasks. Responsibilities include building and assembling units such as printed circuit assemblies (PCAs), modules, and subassemblies, as well as performing precision micro-electronics work including wire bonding under a microscope. This role supports production and engineering by executing assembly processes, assisting with troubleshooting, and ensuring product quality, reliability, and compliance with established manufacturing standards.

Key Responsibilities-other duties as assigned.

  • Assemble electronic and electro-mechanical subassemblies following production drawings, work instructions, and engineering documentation.

  • Perform precision micro-electronics assembly, including wire bonding operations (ball and wedge bonding) using specialized bonding equipment under a microscope.

  • Interpret schematics, wiring diagrams, bills of material (BOMs), and manufacturing instructions to determine required components and processes.

  • Install and connect electronic components onto PCBs and substrates.

  • Perform soldering and de-soldering on through-hole and surface-mount components.

  • Set up, operate, and maintain wire bonding equipment, ensuring proper bond integrity.

  • Inspect wire bonds and micro-electronic assemblies using microscopes and measurement tools.

  • Perform rework, repair, and troubleshooting of assemblies.

  • Support engineering activities including process improvements and documentation updates.

  • Use hand tools, microscopes, jigs, and fixtures to assemble and secure components.

  • Perform epoxy application, encapsulation, curing, and cleaning processes.

  • Conduct in-process inspections and visual checks to ensure quality standards are met.

  • Maintain accurate production records and documentation.

  • Follow all safety and ESD procedures.

  • Maintain a clean and organized work environment.

Requirements

  • High school diploma or equivalent required; technical training preferred.

  • 0–3 years of experience in electronic assembly, micro-electronics, or wire bonding.

  • Experience with microscope work and fine motor skills required.

  • Basic understanding of electronic components and schematics.

  • Ability to perform soldering and micro-assembly tasks to standard

  • Familiarity with ESD controls and IPC standards preferred.

  • Strong attention to detail and ability to work with small components.

  • Ability to follow detailed instructions and procedures.

  • Basic troubleshooting skills.

  • Good manual dexterity and hand-eye coordination.

  • Ability to work effectively in a team environment.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws. ​

You may not realize it, but Teledyne enables many of the products and services you use every day .

Teledyne provides enabling technologies to sense, transmit and analyze information for industrial growth markets, including aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, energy, medical imaging and pharmaceutical research.

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