Assembly Integration Engineer

Job Description

Insight Global is looking for a Integration Engineer with a key focus in assembly / factory integration (RDL/Die Prep/ TCB/ underfill dispense/ Molding/ temporary bonding & debonding) to work on site in Austin, TX and support the strategy and introduction of products based on unique and highly differentiated capabilities of a preeminent foundry for semiconductor systems and defense electronics companies. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. They are developing cutting-edge semiconductor manufacturing technology that will define future roadmaps of semiconductor devices including logic, memory, 3D packaged devices, including thermal management, etc. The Integration Engineer or Senior Integration Engineer will focus on processing of test and demonstration vehicles in advanced Heterogeneous Integration projects. This role will initially involve toolset installation/qualification and evolve into establishing best known method (BKM) flows, characterizing performance and executing improvements to enhance yield and reliability.

Responsibilities Drive unit process engineers and tool / material vendors towards achieving defined targets for integrated test vehicles. Develop successful shortloop and full integrated processes to demonstrate various heterogeneous integration prototypes. Significant hands-on role within the cleanroom is expected, initially with shared ownership of critical unit processes. Define process window and resolve excursion through structured troubleshooting and investigation of failure modes. Design and evaluate results of experiments on test vehicles for mechanical / electrical performance and reliability. Able to work in a team environment, mentor junior engineers / students and communicate effectively.

Skills and Requirements

3 + years of experience working as a Integration Engineer Proficient with RDL/ Die Prep/ TCB/ underfill dispense/ Molding/ temporary bonding & debonding Experience managing the integration of tool owners and process engineers within a factory Experience working in cleanroom or fab environment Strong data analytical skills (JMP, Python etc.) and communication skills. Master’s degree or Doctoral degree in semiconductor engineering fields such as Electrical Engineering, Chemical Engineering, Materials Science or other relevant disciplines. Experience within advanced packaging Background in defense industry

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal employment opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment without regard to race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request to [email protected].