Associate Quantum Hardware Assembly R&D Engineer

Introduction

Overview

IBM Quantum is seeking a motivated Associate Quantum Hardware Assembly R&D Engineer to join the Quantum Hardware team at the IBM Thomas J. Watson Research Center in Yorktown Heights, NY. This entry-level role offers an exciting opportunity to develop advanced electronic packaging technologies for next-generation quantum computing systems.

The ideal candidate is a collaborative team player with strong attention to detail, a strong growth mindset, and a passion for hands-on engineering and experimentation. Working alongside world-class scientists and engineers, you will use state-of-the-art assembly and characterization tools to develop new hardware, processes, and packaging technologies for superconducting qubit systems. Prior experience with quantum hardware is not required. We are looking for candidates with a strong technical foundation, a willingness to learn, and enthusiasm for solving challenging engineering problems. This is a fully on-site position.

Your role and responsibilities

Key Responsibilities

As an Associate Quantum Hardware Assembly R&D Engineer, you will support the research, development, fabrication, and characterization of advanced electronic packaging technologies for quantum hardware.

Responsibilities include:

• Developing and optimizing assembly processes for next-generation quantum devices, including surface mount technology (SMT), die attach, flip-chip assembly, and related packaging techniques.

• Evaluating assembly yields, process capability, and package performance through electrical, mechanical, and physical characterization methods.

• Supporting hardware integration, process troubleshooting, and root-cause investigations to resolve assembly and packaging-related issues.

• Documenting experimental methods, results, and recommendations through technical reports, presentations, and formal documentation.

• Collaborating with multidisciplinary teams across IBM Quantum to support hardware development, integration, and technology maturation efforts.

Required technical and professional expertise

Required Professional and Technical Expertise

• Ability to independently troubleshoot and solve complex technical problems.

• Ability to work effectively with interdisciplinary teams, including electrical engineers, fabrication engineers, materials scientists, and experimental physicists.

• Strong growth mindset with a desire to continuously learn and develop new skills.

• Strong attention to detail and commitment to high-quality work.

Required Education

• Bachelor's degree in Materials Science and Engineering, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical field.

Preferred technical and professional experience

Preferred Qualifications

• Academic, internship, or research experience involving materials development, characterization, or process engineering.

Bonus Qualifications

• Hands-on experience with electronic packaging and assembly techniques, including die attach, flip-chip assembly, surface mount technology (SMT), soldering, or related processes.

• Experience with optical microscopy, SEM, cross-sectioning, metrology, and basic electrical testing.

• Familiarity with process development, statistical process control, yield analysis, or design-of-experiments (DOE) methodologies.

IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.