Module Engineer Internship

Job Details:

Job Description: Step into the world of advanced semiconductor manufacturing and help shape the future of technology. At Intel Ireland, we're not just building semiconductor chips, we're building the future.

As a Module Engineering Intern, you'll join a team of passionate engineers working on Intel's most advanced process technologies. You'll gain hands-on experience in a high-tech, fast-paced environment where innovation, collaboration, and continuous learning are at the heart of everything we do.

This internship is your opportunity to apply your STEM education in a real-world setting, working alongside experienced engineers to solve complex problems, optimize manufacturing processes, and contribute to the development of world-changing technology.

Responsibilities / What You'll Do

• Responsible for safety, quality, operational performance, and improving productivity in addition to cost reduction for their module.

• Ownership and qualification of process modules and/or equipment, including Preventative Maintenance, Root Cause analysis, Monitoring Process Performance, and Defect Reduction

• Collaborate with cross-functional teams to solve technical challenges using structured, model-based problem-solving techniques.

• Contribute to sustaining and improving Intel's Virtual Factory standards and process matching across global sites.

• Engage in continuous learning and development through mentorship and training.

Qualifications: Minimum Requirements:

• Currently pursuing a Level 8 or Level 9 qualification in a relevant STEM discipline (e.g. Physics, Applied Chemistry, Chemical Engineering, Electronic Engineering, Mechanical Engineering, etc.).

• Strong analytical and problem-solving skills.

• Excellent communication skills - both written and verbal.

• Ability to work independently and as part of a diverse, high-performing team.

• Willingness to work in a cleanroom environment.

• Strong attention to detail and disciplined approach to procedures.

Preferred Experience:

• Experience with data analysis tools and software (e.g. JMP, Python, Excel).

• Ability to summarize data for technical and non-technical audiences.

What We Offer

• A dynamic, inclusive, and innovative work environment.

• Hands-on experience with cutting-edge semiconductor technology.

• Mentorship from experienced engineers and opportunities to grow your technical and professional skills.

• Exposure to Intel's global manufacturing operations and Virtual Factory model.

• The chance to contribute to meaningful projects that impact the lives of every person on the planet.

You must also be available for six+ months in 2027 with a preferred starting date between January and June 2027.

Job Type: Student / Intern

Shift: Shift 1 (Ireland)

Primary Location: Ireland, Leixlip

Additional Locations:

Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A EU Salary We offer a total compensation package that ranks among the best in the industry. The minimum Annual Salary for this job which could be performed in Ireland is: €31,400.00 The job posting reflects the minimum base compensation for this role. Our standard internship rates are aligned with the specific job role and degree level. As part of our total compensation approach, the final offer may also include additional pay components and benefits. Your recruiting team will provide the confirmed base salary along with any applicable total compensation elements upon employment offer delivery. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. *