Advanced Packaging Engineer

Description

SAIC is seeking a talented and motivated Advanced Packaging Engineer to support cutting-edge missile system hardware design and analysis efforts. In this role, you will collaborate with multidisciplinary engineering teams to develop, analyze, and validate advanced microelectronics packaging solutions for complex defense systems.

JOB RESPONSIBILITES:

• Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly

• Perform mechanical modeling and simulation activities, including finite element analysis (FEA), thermal fatigue, shock and vibration analysis, and MATLAB-based modeling

• Apply systems engineering principles throughout all stages of the product lifecycle, including requirement development, verification, and validation

• Participate in and support Systems Engineering Technical Reviews, including System Requirements Reviews (SRR), Preliminary

• Design Reviews (PDR), Critical Design Reviews (CDR), and Production Readiness Reviews (PRR)

• Collaborate with design teams to facilitate and document design development activities

• Support Technical Interchange Meetings (TIMs) and contribute to cross-functional team discussions

• Analyze solder interconnect technologies, including Ball Grid Array (BGA), Column Grid Array (CGA), Flip-Chip, and J-lead packages

• Conduct experimental test and evaluation activities, including solder fatigue analysis and material property evaluations

• Clearly communicate technical findings, analyses, and recommendations to a wide range of audiences, including both technical and non-technical stakeholders

Qualifications

REQUIRED EDUCATION AND EXPERIENCE:

• Bachelor's degree in Mechanical or Aerospace Engineering

• We are looking to hire two candidates at different levels:

• 3+ years experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue)

• 10+ years experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue)

• Experience with or knowledge of systems engineering principles

• Interim secret clearance is required to start with the ability to obtain a secret clearance. SAIC will sponsor the clearance process

• Must be a US citizen

PREFERRED EXPERIENCE:

• Experience with missile system hardware design and analysis

• Familiarity with microelectronics packaging and assembly, including solder interconnect technologies

REQNUMBER: 2617366

SAIC is a premier technology integrator, solving our nation's most complex modernization and systems engineering challenges across the defense, space, federal civilian, and intelligence markets. Our robust portfolio of offerings includes high-end solutions in systems engineering and integration; enterprise IT, including cloud services; cyber; software; advanced analytics and simulation; and training. We are a team of 23,000 strong driven by mission, united purpose, and inspired by opportunity. Headquartered in Reston, Virginia, SAIC has annual revenues of approximately $6.5 billion. For more information, visit saic.com. For information on the benefits SAIC offers, see Working at SAIC. EOE AA M/F/Vet/Disability