Senior Project Manager for Chip-to-Package Interaction (CPI) Qualifications

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role:

To further strengthen our Chip-to-Package Interaction (CPI) team, we are seeking an experienced and highly motivated Senior Qualification Project Manager with a strong background in semiconductor technology development, project management, post-fab technologies (bumping, assembly, and package-level testing), BEOL integration fundamentals, and reliability qualification methodologies.

In this role, you will lead CPI qualification programs from concept through qualification and technology release, working closely with global, cross-functional teams including technology development, design, reliability engineering, manufacturing, and external assembly and test partners (OSATs). You will play a key role in enabling next-generation semiconductor packaging solutions and advanced technology platforms.

The position is based at GlobalFoundries' facility in Malta, New York.

Essential Responsibilities:

Lead end-to-end CPI qualification projects supporting Technology Development Programs, including:

• Define CPI qualification strategies, scope, deliverables, milestones, and success criteria in alignment with technology development objectives.

• Develop and maintain project plans, schedules, budgets, resource forecasts, and risk mitigation strategies to ensure successful program execution.

• Coordinate and lead cross-functional teams across Technology Development, Design, Reliability Engineering, Manufacturing, Quality, Supply Chain, and external partners.

• Support the selection and management of outsourced semiconductor assembly and test (OSAT) partners to ensure timely delivery of qualification objectives.

• Drive test vehicle planning, design definition, and qualification vehicle implementation in support of program requirements.

• Define reliability qualification plans, test structures, characterization requirements, and data collection strategies to assess CPI performance and robustness.

• Track project progress, qualification metrics, reliability results, budgets, and schedules, ensuring achievement of technical, quality, cost, and timeline objectives.

• Proactively identify, assess, and mitigate project risks, technical challenges, and schedule impacts, and drive appropriate escalation and resolution.

• Lead technical and program reviews, facilitate cross-functional decision-making, and ensure alignment on qualification strategies and program priorities.

• Drive milestone readiness assessments and lead qualification reviews to support technology and product release decisions.

• Support customer engagements by communicating qualification strategies, project status, reliability results, and technology readiness.

• Prepare and present project updates, technical recommendations, risk assessments, and executive summaries to management, customers, and external stakeholders.

• Establish effective communication and collaboration across global teams and partner organizations to ensure successful project execution.

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications:

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or a related technical discipline.

• Minimum of 5 years of experience in the semiconductor industry, with a background in technology development, packaging, assembly, reliability engineering, qualification, or related areas.

• Proven success leading complex, cross-functional technical projects from concept through qualification and technology release.

• Strong knowledge of semiconductor packaging and post-fab technologies, including bumping, assembly, package-level testing, and OSAT operations.

• Solid understanding of BEOL process integration, chip-to-package interactions, and semiconductor reliability qualification methodologies.

• Experience defining qualification plans, test structures, characterization requirements, and technology readiness assessments.

• Demonstrated project management experience, including schedule, budget, resource, and risk management.

• Strong leadership, communication, and stakeholder management skills, with the ability to effectively influence and coordinate global teams and external partners.

• Excellent analytical and problem-solving skills, with the ability to manage multiple priorities in a dynamic technology development environment.

Preferred Qualifications

• Experience with packaging technologies such as wirebond, flip-chip, wafer-level packaging (WLP), 2.5D/3D integration, TSVs, silicon interposers, or chiplet-based solutions.

• Knowledge of industry qualification and reliability standards, including JEDEC and AEC-Q100.

• Experience working with customers, OSATs, and external technology partners.

• Experience supporting Technology Development and Technology Qualifications.

• PMP certification or equivalent project management qualification.

• Experience working in a global semiconductor manufacturing environment.

Expected Salary Range

$98,000.00 - $176,000.00

The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at [email protected] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law