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Module Development Engineer

Intel

Hillsboro, ORFull-time$99–163K/yrPosted 2w agoVerified open 4 days ago

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At a glance

Compensation
$99–163K/yr
Location
Hillsboro, OR
Schedule
Full-time
Work Authorization
Not specified

Requirements

Credentials this posting asks for.

Bachelor's degree

Job overview

Intel is hiring a Module Development Engineer. Intel seeks a Module Development Engineer to lead thermal, mechanical, and electrical design of media for semiconductor assemblies, define package performance, conduct material testing, establish specifications, and provide consulting on packaging challenges while responding to customer requests.

Key focus areas include Responsible for the thermal/mechanical/electrical design, analysis, and development of media, Define overall package performance and specification and realize technology certification through qualification plans and data collection, and Conduct tests and research on basic materials and properties.

Important skills include Mechanical Design, CAD, SolidWorks, DriveWorks, RSS Analysis, and Geometric Dimensioning. Preferred (not required): Material Handling Systems, High Speed Pick-and-Place, Motion Control, and Vision Systems.

Skills & qualifications

RequiredNice to have

Skills

Mechanical DesignCADSolidWorksDriveWorksRSS AnalysisGeometric DimensioningFinite Element AnalysisFull Cycle Project ManagementThermal DesignElectrical DesignMaterial Handling SystemsHigh Speed Pick-and-PlaceMotion ControlVision SystemsStatistical Design of ExperimentsProblem Solving TechniquesStakeholder ManagementSemiconductor DevicesPackaging ProcessesMedia DesignEquipment Collateral

Qualifications

Bachelor's in Mechanical Engineering or Related STEM Field or Master's in Mechanical Engineering or Related STEM Field4+ Years Experience or 2+ Years Experience With Master's Degree3+ Years Experience With One or More of the Following

Benefits

Medical Insurance

Full job description

Job Details:

Job Description:  Module Packaging Media Engineers provide project management, media design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

The responsibilities include but are not limited to the following:

  • Responsible for the thermal/mechanical/electrical design, analysis, and development of media.
  • Defines overall package performance and specification and realizes technology certification through qualification plans and data collection.
  • Conducts tests and research on basic materials and properties.
  • Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
  • Provides consultation concerning packaging problems and improvements in the packaging process.
  • Responds to customer/client requests or events as they occur.
  • Develops solutions to problems utilizing formal education and engineering judgment.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Candidate must possess a bachelor’s degree in mechanical engineering or related STEM field and 4+ years of experience OR a Master’s degree in the same fields with 2+ year of experience.

Experience listed above should be a combination of the following:

Mechanical Design, CAD/Solidworks/Driveworks/RSS analysis/Geometric Dimensioning/Finite Eliminate Analysis experience. Full cycle project management experience.

Preferred Qualifications:

3+ years of experience with one or more of the following:

Material handling systems including high speed/accuracy pick-n-place, motion control and vision systems. Fundamental science and engineering concepts in development to create a novel design solutions for high volume manufacturing process. Stakeholder management (ex.supplier/ project management/internal partner management) Semiconductor devices and packaging processes and technology. Technical and analytical skills, with the knowledge of statistical design of experiments and problem-solving techniques.

Media design experience

Equipment collateral experience

Job Type: Experienced Hire

Shift: Shift 1 (United States of America)

Primary Location:  US, Oregon, Hillsboro

Additional Locations:

Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $99,030.00-162,500.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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