Senior Photonics Engineer
General Dynamics Mission Systems, Inc.
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At a glance
Requirements
Credentials this posting asks for.
Job overview
General Dynamics Mission Systems, Inc. is hiring a Senior Photonics Engineer. General Dynamics Mission Systems is seeking a Senior Photonics Engineer to lead photonic design execution across multiple programs and technology platforms. This role involves tackling a wide breadth of photonic and optoelectronic design challenges, from integrated photonic circuits to optical communication systems. The engineer will contribute to IRAD projects, technology development, and participate in customer-facing technical discussions and design reviews.
Key focus areas include Lead the full PIC design cycle process, Design PIC circuits and components using foundry PDKs and first-principles approaches, and Execute PIC layout using Luceda IPKISS or equivalent tools.
Successful candidates bring Bachelor's Degree Or Higher, Department of Defense TS/SCI Clearance, and U.S. Citizenship. Important skills include Luceda IPKISS, Lumerical, Tidy3D, Photonforge, PIC Design Cycle Process, and Component Design. Preferred (not required): Simulation, Layout, Wirebond, and Flip-Chip.
Skills & qualifications
Skills
Qualifications
Full job description
Experience Required
8 - 20 years
Minimum Education Required
Bachelor Degree
Compensation
$175,332.00 - $184,920.00 / Yearly
Hours Per Week
40
Number Of Positions
1
Shift
First Shift (Day)
Job Description
Basic Qualifications
Education Requirements:
Requires a Bachelor's degree in Electrical Engineering, or a related Science, Engineering, Technology or Mathematics field. Also requires 8+ years of job-related experience, or a Master's degree plus 6 years of job-related experience.
Clearance Requirements:
Ability to obtain a Department of Defense TS/SCI security clearance is required at time of hire. Applicants selected will be subject to a U.S. Government security investigation and must meet eligibility requirements for access to classified information. Due to the nature of work performed within our facilities, U.S. citizenship is required.
Responsibilities for this Position
General Dynamics Mission Systems designs, prototypes, packages, and tests custom photonic integrated circuit (PIC) and photonic subsystem solutions for mission-critical defense and intelligence applications.
We are seeking a Senior Photonics Engineer to lead photonic design execution across multiple programs and technology platforms. You will tackle a wide breadth of photonic and optoelectronic design challenges - from integrated photonic circuits to optical communication systems to more complex and advanced systems.
Core Responsibilities:
Lead the full PIC design cycle process: requirements analysis, component and circuit design, simulation, layout, foundry tape-out, post-fabrication test, and design iteration
Design PIC circuits and components using foundry PDKs and first-principles approaches as needed
Execute PIC layout using Luceda IPKISS or equivalent tools
Perform photonic simulation using Lumerical, Tidy3D, Photonforge, or equivalent tools
Manage tape-out with domestic foundries including design rule checks, foundry interface, and run coordination
Lead testing and characterization activities for fabricated PIC devices - optical and electrical measurements on bare die and packaged parts
Design PICs with packaging in mind - fiber coupling, electrical fanout (wirebond and flip-chip), thermal, and mechanical constraints
Contribute to optical system and link-level design and trade studies where programs extend beyond the chip level
Mentor junior engineers and team members
Contribute to IRAD projects and technology development
Participate in customer-facing technical discussions and design reviews
Contribute to technical and cost proposals
We encourage you to apply if you have these skills and experiences:
Bachelor's degree in Electrical Engineering, Photonics, Applied Physics or other relevant field plus a minimum of 8 years of relevant experience OR Master's degree plus a minimum of 6 years of relevant experience OR PhD degree plus a minimum of 3 years of relevant experience
Experience with full-lifecycle PIC design: concept modeling tape-out test
PIC layout tools (Luceda IPKISS, Photonforge, or equivalent)
Photonic simulation tools (Lumerical, Tidy3D, or equivalent)
Foundry tape-out experience at a commercial photonics foundry.
Experience on at least one major photonics platform: silicon, silicon nitride, lithium niobate
Working knowledge of core PIC building blocks: waveguides, couplers, ring resonators, AWGs, MZIs, modulators, photodetectors
PIC test and characterization - fiber-coupled and probe-based measurements
Technical leadership or mentorship of small engineering teams
Python or scripting for design automation or test
Nice to have:
Post-fabrication packaging experience: fiber array attach, wirebond or flip-chip integration, optical alignment, or managing external packaging vendors
Multi-platform PIC experience across two or more of: silicon photonics, silicon nitride, III-V (InP), thin-film lithium niobate (TFLN)
Optical system-level design or systems engineering for communication or sensing systems
Familiarity with active photonic devices (lasers and amplifiers) and their integration into PIC-based systems
RF photonics or analog photonic link design
Nonlinear photonics (microresonator frequency combs, four-wave mixing, stimulated Brillouin scattering)
What sets you apart:
A track record of taking a PIC from concept through tape-out to packaged, tested hardware - the complete journey, not just simulation or layout
Multi-platform adaptability across different material systems and foundry processes
Experience specifying packaging requirements and managing external assembly vendors to deliver integrated photonic modules
Technical leadership on small design teams - defining approach, distributing work, and delivering as a team
Combined depth in PIC design and breadth in optical or RF system-level engineering - you design the chip and understand the system it lives in
Adjacent domain experience in free-space optical (FSO) communication systems, fiber-optic telecom systems, or RF systems.
Ability to think creatively, multi-task, and communicate with internal and external stakeholders
Identifies opportunities to apply AI for continuous improvement and innovation
#LI-JH1
#LI-Hybrid
Target salary range: USD $175,332.00/Yr. - USD $184,920.00/Yr. This estimate represents the typical salary range for this position based on experience and other factors (geographic location, etc.). Actual pay may vary. This job posting will remain open until the position is filled.
Company Overview
General Dynamics Mission Systems (GDMS) engineers a diverse portfolio of high technology solutions, products and services that enable customers to successfully execute missions across all domains of operation. With a global team of 12,000+ top professionals, we partner with the best in industry to expand the bounds of innovation in the defense and scientific arenas. Given the nature of our work and who we are, we value trust, honesty, alignment and transparency. We offer highly competitive benefits and pride ourselves in being a great place to work with a shared sense of purpose. You will also enjoy a flexible work environment where contributions are recognized and rewarded. If who we are and what we do resonates with you, we invite you to join our high-performance team!
Equal Opportunity Employer / Individuals with Disabilities / Protected Veterans
General Dynamics is an Equal Opportunity/Affirmative Action Employer that is committed to hiring a diverse and talented workforce. EOE/Disability/Veteran
Place of Work
On-site
Requisition ID
2026-73243
Job Type
Full Time
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