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Package Development, Signal Integrity and Power Integrity Engineer, Principal

Celestial AI

Santa Clara, CAFull-time$168–249K/yrPosted 3w agoVerified open 3 days ago

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At a glance

Compensation
$168–249K/yr
Location
Santa Clara, CA
Schedule
Full-time
Work Authorization
Not specified

Requirements

Credentials this posting asks for.

Bachelor's degree

Job overview

Celestial AI is hiring a Package Development, Signal Integrity and Power Integrity Engineer, Principal. Marvell’s Central Engineering team seeks a talented high‑speed IC package development engineer to develop advanced microelectronic packages supporting 448 Gb/s data rates, handling electrical design, modeling, and characterization while collaborating with suppliers, marketing, and IC designers.

Key focus areas include Develop advanced microelectronic packages for high‑speed data rates, Perform electrical design, modeling, and characterization of packages, and Consider manufacturing and assembly tolerances in package development.

Successful candidates bring Bachelor's Degree In Computer Science, Electrical Engineering Or Related Fields, 5-8 Years Of Related Professional Experience, and 1-3 Years Of Experience. Important skills include Packaging, Department of State, Scripting, EM, Transmission Lines, and Microwave Theory. Preferred (not required): Optics, PCB design, 3D, and Modeling.

Skills & qualifications

RequiredNice to have

Skills

PackagingDepartment of StateScriptingOpticsPCB Design3DModelingArtificial IntelligenceSignal IntegrityMatlabLicensingExport ControlsIntegrated Circuit DesignCharacterizationANSYSMarketingPythonInterviewsDepartment of CommerceAdvertisingData InfrastructureEMTransmission LinesMicrowave TheoryAnsys HFSSSI-WaveCadence ClarityPackage Development ManagementSpectreADSHSpiceVNA MeasurementsTDR MeasurementsFrequency Domain KnowledgeTime Domain KnowledgeHigh-Speed Electronic PackagingPower Plane DesignPowerSISIwavePackaging TechnologiesMaterialsPackage Substrate Design RulesAssembly RulesEMI/EMC DebuggingEMI/EMC SimulationsTeam PlayerCommunicationPresentationDocumentationCo-Packaged OpticsOptics PackagingNew Product IntroductionThermal AnalysisMechanical AnalysisChannel SimulationsAPDPADSEMI/EMC Problems DebuggingEMI/EMC Problems SimulationsFrequency DomainTime Domain2.5D/3D Package Development

Qualifications

Bachelor's in Computer Science, Electrical Engineering or Related Fields5-8 Years of Related Professional Experience1-3 Years of Experience

Full job description

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances. The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.

What You Can Expect

Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances. The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.

What We're Looking For

  • Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5 - 8 years of related professional experience or Master’s/PhD in Computer Science, Electrical Engineering or related fields with 1-3 years of experience.
  • Strong fundamentals in EM, transmission lines and microwave theory
  • Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity
  • Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing.
  • Familiarity with IC package layout tools like APD or PADS
  • Familiarity with Co-Packaged Optics and Optics packaging is a plus
  • Experience with 2.5D/3D package development is highly desired.
  • Ability to automate the SI, PI and Packaging activities using scripting tools like Python.
  • Working knowledge of circuit design tools: Spectre, ADS, HSpice
  • Experience with VNA and TDR measurements for package and PCB characterization
  • Frequency domain and time domain knowledge of high speed signaling
  • Experience with high-speed electronic packaging for digital and analog ICs
  • Power plane design, modeling and analysis using tools like PowerSI, SIwave
  • Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
  • Understanding, debugging and simulations of EMI/EMC problems
  • Track record of new product introduction from concept, through development and production is a plus.
  • Knowledge of the thermal and mechanical analysis of the IC package development is a plus.
  • Experience with channel simulations using MATLAB or ADS or other tools is a plus.
  • A team player
  • Strong communication, presentation, and documentation skills

Expected Base Pay Range (USD)

168,400 - 249,310, $ per annum

The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at [email protected] .

Interview Integrity

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.

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