Packaging Engineer
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At a glance
Requirements
Credentials this posting asks for.
Job overview
Trumpf, Inc. is hiring a Packaging Engineer. TRUMPF, Inc. is seeking a Packaging Engineer to join their team. This role focuses on optimizing critical processes for high-power diode laser devices, including precision mounting, bonding, and interface characterization. The engineer will be responsible for production tools and processes, driving continuous improvement and partnering with R&D for new process industrialization.
Key focus areas include Own and optimize die bonding and wire bonding processes for high-power diode lasers, Lead interface characterization and packaging process tuning based on optical KPIs, and Take full ownership of production equipment, including process control and sustaining.
Important skills include Die Bonding, Wire Bonding, Vacuum Reflow, Pick And Place, SPC, and DOE.
Skills & qualifications
Skills
Qualifications
Full job description
Experience Required
None
Minimum Education Required
Master Degree
Compensation
$15.92 / Hourly
Hours Per Week
40
Number Of Positions
1
Shift
First Shift (Day)
Job Description
As a family-run, high-tech company with nearly 19,000 employees at 71 locations worldwide, we are looking for forward thinkers with unconventional ideas and drive to join our team. Our company culture, which values collaboration and mutual trust, creates the ideal framework for boldly trying new things and questioning the status quo. Our technologies inspire people to develop and produce things that are currently unimaginable. Whether lasers, machine tools, EUV or electronics - TRUMPF is building technological worlds for future generations. Are you ready for new challenges?
Join a team pushing the limits of laser technology. As a Packaging Engineer, you'll own critical processes that turn cutting-edge diode laser devices into production-ready powerhouses-driving performance through precision mounting, bonding, and interface characterization.
You'll be the go-to expert for key production tools and processes, championing uptime, stability, and continuous improvement while partnering closely with R&D to bring new concepts to life on the factory floor.
What you'll do
Own and optimize die bonding and wire bonding processes and tools for highpower diode lasers.
Lead interface characterization and packaging process tuning based on optical KPIs (power, voltage, slow axis, smile, placement accuracy, etc.).
Take full ownership of production equipment: process control, sustaining, tool uptime, and maintenance troubleshooting.
Drive yield improvement and cost reduction initiatives; spot yield excursions fast and implement robust corrective actions.
Lead and contribute to 4D/8D problem-solving and shepherd ECNs, including MES/Database updates.
Partner with R&D to industrialize new processes; define qualification plans and specifications for new equipment and methods.
Use SPC, MSA, DOE, and JMP/Minitab to deliver datadriven process improvements.
Tackle complex equipment and process issues with structured troubleshooting; deliver highquality results on time.
Communicate clearly, influence crossfunctional teams, and mentor peers while executing welldefined tasks with guidance as needed.
What you bring
BS or MS in Mechanical/Electrical Engineering, Materials Science, or Physics.
3+ years handson with die attach, thermocompression bonding, wire bonding, vacuum reflow, and pickandplace.
Manufacturing support experience in lasers or semiconductors (preferred).
Familiarity with K&S or F&K wire bonders, and/or SET die bonders (plus).
Strong with JMP, Minitab, or similar statistical tools; fluent in SPC/DOE/Six Sigma/problem solving (certification a plus).
Proven track record driving crossfunctional issue resolution and leading teams.
Comfortable in a cleanroom environment (gowning required).
Excellent communicator who gives and receives feedback constructively.
Why this role
Impact: Your processes directly shape performance in advanced laser products.
Variety: From sustaining and yield to ECNs and newprocess quals-no two days are the same.
Growth: Work at the intersection of production and R&D with room to lead.
Pay Range: $93,253.50 - $112,504
TRUMPF Inc. endeavors to make TRUMPF careers pages accessible to any and all users. If you would like to contact us regarding the accessibility of our website or need assistance in completing the applications process, please contact our HR department at 860.255.6000 or at [email protected] contact information is for accommodation requests only and can not be used to inquire about the status of application.
TRUMPF is an Equal Opportunity Employer. Employment is based upon personal capabilities and qualifications without regard to race, color, religion, sex, marital status, national origin, ancestry, age, past or present history of mental disorder, physical, or learning disability, mental retardation, sexual orientation, genetic information or any other protected characteristic as established by law. This policy of Equal Employment Opportunity applies to all policies and procedures relating to recruitment and hiring, compensation, benefits, termination, and all other terms and conditions of employment.
Place of Work
On-site
Requisition ID
R00039723
Job Type
Full Time
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