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Semiconductor Assembly Operator

HEICO

Sunnyvale, CAJobNo compensation foundTracked 1w agoSeen in employer's feed 5 days ago

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At a glance

Compensation
No compensation found
Location
Sunnyvale, CA
Work Authorization
Not specified

Job overview

HEICO is hiring a Semiconductor Assembly Operator. Pyramid Semiconductor, part of the HEICO group, is seeking a Semiconductor Assembly Operator to perform die attach, operate wire bonding equipment, and handle various assembly tasks such as clipping, sealing, visual inspection, burn‑in, and testing in a cleanroom environment.

Key focus areas include Performs die attach of die to various packages, Performs wire bonding of the devices using manual and automated bonders, and Clips the devices with lids and performs sealing of the devices.

Important skills include Die Attach, Wire Bonding, Manual Bonder Operation, Automated Bonder Operation, Device Lidding, and Device Sealing.

Skills & qualifications

RequiredNice to have

Skills

Die AttachWire BondingManual Bonder OperationAutomated Bonder OperationDevice LiddingDevice SealingCleanroom WorkFollow InstructionsCollaboration

Qualifications

High School Diploma or Equivalent5+ Years Semiconductor Manufacturing ExperienceAbility to Work in Cleanroom EnvironmentAbility to Follow InstructionsAbility to Work in Team Environment

Benefits

Medical Insurance
Dental Insurance
Vision Insurance
401(k) Match
Paid Time Off

Full job description

Job Description

Pyramid Semiconductor, part of the HEICO group (www.heico.com, NYSE HEI), is a manufacturer of semiconductors components. Pyramid Semiconductor is a complete semiconductor integrated circuit designer and manufacturer. We provide our customers with high reliability parts for their legacy programs.

We are currently looking for a Semiconductor Assembly Operator to join our team. The primary responsibility of this position is to perform die attach and operate a wire bonding machine to wire silicon dice on ceramic packages. Additionally, based on the manufacturing needs, the person will be trained in different positions such as visual inspection, burn-in, testing, and other duties as assigned.

Main responsibilities :

  • Performs die attach of die to various packages.

  • Performs wire bonding of the devices using the manual and automated bonders

  • Clip the devices with lids and performs sealing of the devices.

  • Coordinates various tasks in assembly for optimum performance.

Requirements

Key qualifications :

  • High school diploma or equivalent required.

  • 5+ years of experience in a semiconductor manufacturing environment, including wire bonding.

  • Ability to work in a cleanroom environment.

  • Ability to follow instructions, work in a team environment, and assist where needed.

Compensation and benefits:

BCBS and Kaiser medical plans with different options

  • Dental and vision plans

  • 401(k) with employer match

  • Sick and Vacation time

  • Health Savings Account (HSA) with Company Contributions

And more...

We are committed to providing our employees with opportunities for growth and development.

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