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Process Engineer (Die Attach / Wire Bond / Active Alignment / Overall Line)

Lumilens

New Square, NYJobNo compensation foundPosted 1w agoVerified open 3 days ago

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At a glance

Compensation
No compensation found
Location
New Square, NY
Work Authorization
Not specified

Requirements

Credentials this posting asks for.

Bachelor's degree

Job overview

Lumilens is hiring a Process Engineer (Die Attach / Wire Bond / Active Alignment / Overall Line). Lumilens is seeking hands‑on Process Engineers to support volume manufacturing ramp‑up at its Bulim facility, focusing on process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high‑precision automation lines.

Key focus areas include Establish robust process windows, parameter recipes, and SOPs for assigned production modules, Monitor line yield metrics, lead 8D root‑cause failure analysis, and implement corrective actions, and Partner with NPI and Equipment Engineering to qualify new tooling, materials, and automation platforms.

Important skills include Process Development, Continuous Improvement Process, Wire Bonding, Statistical Process Controls, Root Cause Analysis, and Collaboration.

Skills & qualifications

RequiredNice to have

Skills

Process DevelopmentContinuous Improvement ProcessWire BondingStatistical Process ControlsRoot Cause AnalysisCollaborationMechanical EngineeringElectrical Engineering TechnologyMechatronicsMaterials ScienceManufacturing EngineeringProblem SolvingJMPMinitabGD&TStatistical Process ControlDOEFMEACpk Analysis8D5-WhyFishboneLine BalancingYield TrackingCleanroom ProtocolsEpoxy/Eutectic DispenseHigh-Precision Pick-and-PlaceFlip-Chip BondingBall/Wedge Wire BondersBond Pull/Shear TestingMulti-Axis Optical AlignmentCollimationLaser/Lens PositioningUV Cure Dispensing

Qualifications

Bachelor’s Degree or Diploma in Mechanical EngineeringBachelor’s Degree or Diploma in Electrical/Electronic EngineeringBachelor’s Degree or Diploma in Mechatronics EngineeringBachelor’s Degree or Diploma in Materials ScienceBachelor’s Degree or Diploma in Manufacturing Engineering2+ Years Process Engineering ExperienceDomain Expertise in Die BondDomain Expertise in Wire BondDomain Expertise in Active AlignmentDomain Expertise in Overall Process IntegrationWillingness to Work on-Site at Bulim Plant

Full job description

About Lumilens At Lumilens, we are building the essential photonics infrastructure that will drive tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is ushering in a new era of computing that is faster, cooler, and dramatically more efficient. We’re a well-funded startup backed by Mayfield and led by veterans who have built and scaled some of the industry’s most transformative technologies.

About the Role We are seeking hands-on Process Engineers to support our volume manufacturing ramp-up at our Bulim facility. In this role, you will be responsible for process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high-precision automation lines.

We are hiring across multiple domain specializations:

  • Die Attach (DB / Die Bond)

  • Wire Bond (WB)

  • Active Alignment (AA / Optical Alignment)

  • Process Engineering – Overall / Integration

Key Responsibilities

  • Process Setup & Optimization: Establish robust process windows, parameter recipes, and standard operating procedures (SOPs) for assigned production modules (DB, WB, AA, or End-to-End Line Integration).

  • Yield & Defect Reduction: Monitor line yield metrics, lead 8D root-cause failure analysis (FA), and implement corrective actions for recurring process/equipment defects.

  • NPI to Mass Production: Partner with NPI and Equipment Engineering to qualify new tooling, materials (epoxies, substrates, bonding wire), and automation platforms for high-volume ramp.

  • Statistical Process Control: Apply SPC, DOE, FMEA, and Cpk analysis to drive process stability, cycle time reduction, and cost-efficiency initiatives.

  • Cross-Functional Collaboration: Work closely with Manufacturing Operators, Quality Engineers, and Maintenance Technicians to resolve line stops and uphold quality standards.

Qualifications & Requirements

  • Education: Bachelor’s Degree or Diploma in Mechanical, Electrical/Electronic, Mechatronics, Materials Science, or Manufacturing Engineering.

  • Experience: 2+ years of relevant process engineering experience in semiconductor packaging, microelectronics, surface-mount technology (SMT), or camera/optical module manufacturing.

  • Domain Expertise (one or more of the following):

  • Die Bond (DB): Experience with epoxy/eutectic dispense, high-precision pick-and-place, and flip-chip bonding.

  • Wire Bond (WB): Experience with ball/wedge wire bonders (gold/copper/aluminum wire) and bond pull/shear testing.

  • Active Alignment (AA): Experience with multi-axis optical alignment, collimation, laser/lens positioning, and UV cure dispensing.

  • Overall Process: Strong background in line balancing, end-to-end yield tracking, DOE, and cleanroom protocols.

  • Technical Skills: Proficiency in SPC tools (JMP, Minitab), GD&T, and structured problem-solving methodologies (8D, 5-Why, Fishbone).

  • Work Arrangement: Willingness to work on-site at the Bulim plant and support operational needs during ramp-up phases.

Benefits

  • Competitive salary and benefits

  • Opportunities for career advancement

  • Work with a world-class team solving cutting-edge challenges

  • Collaborative and innovative work environment

Lumilens is committed to building a diverse and inclusive workplace. We are proud to be an equal opportunity employer.

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