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Standard Custom Design Engineer

Synthara Ag

Zürich, Zurich, SwitzerlandJobPosted 11mo agoStill listed 1 day ago

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At a glance

Compensation
No compensation found
Location
Zürich, Zurich, Switzerland
Work Authorization
Not specified

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Job overview

The Standard Custom Design Engineer will own mixed-signal subsystems for ComputeRAM® technology, designing, verifying, and characterizing custom ASIC blocks from concept through silicon and production, while collaborating with digital and layout teams to meet aggressive PPA targets on sub‑28 nm CMOS nodes.

Skills & qualifications

RequiredNice to have

Skills

Mixed‑Signal Circuit DesignASIC VerificationSub‑28 Nm CMOSDigital Datapath DesignSRAM DesignData‑Converter DesignUltra‑Low‑Power Amplifier DesignPower‑Management DesignPLL DesignSensor Signal‑Processing DesignTechnical CommunicationCross‑Functional CollaborationPython ScriptingTcl ScriptingAI‑Related Building BlocksCompute‑in‑Memory Knowledge

Qualifications

Hands‑on Sub‑28 Nm CMOS ExperienceQuality‑Oriented ApproachProven Design Ownership in Datapath/Standard‑Cell, Memory/SRAM, Data‑Converters, Ultra‑Low‑Power Amplifiers, Power‑Management, References, PLLs, or Sensor Signal‑Processing ChainsClear Technical CommunicationStructured PlanningComfort Working Cross‑Functionally With Digital/Custom/Layout Teams

Full job description

Role Location: Zürich, Switzerland Seniority: MS +4 years or PhD

Own critical mixed-signal subsystems that bring our compute-in-memory SRAM (ComputeRAM®) from design to silicon and into production. You will design, verify, and characterize custom blocks, including full-custom digital datapaths and memories, and collaborate tightly with our digital and layout teams to hit aggressive PPA and quality targets on modern CMOS nodes, down to 4nm and below. You will deal with multi-disciplinary topics ranging from traditional mixed-signal design to solving digital timing constraints. What you’ll do

  • Design & verify mixed-signal circuits/subsystems for ASICs (architecture, transistor-level design, simulation, corners/Monte-Carlo, modelling).
  • Develop AI-related building blocks as part of our in-memory computing technology.
  • Partner across disciplines on interfaces, buses/standard-cell boundaries, and timing/power budgets.
  • Contribute to IP-quality specifications, reviews, reusable verification collateral, and documentation ready for internal reuse and customer delivery.
  • Continuously improve flows through scripting/automation (e.g., Python/Tcl) for characterization, report generation, and regressions, guaranteeing reproducibility and reliability. (Nice-to-have but valued.)

Outcomes (first 18 months)

  • Complete and document one or more IP blocks
  • Tape-in and silicon of at least one sub-system meeting spec across PVT; complete post-production test plan and correlation report signed off.

Requirements

  • Hands-on sub-28 nm CMOS experience
  • Quality-oriented approach
  • Proven design ownership in one or more of: datapath/standard cells design, memory/SRAM design, data-converters, ultra-low-power amps, power-management, references, PLLs, sensor signal processing chains.
  • Clear technical communication; structured planning; comfort working cross-functionally with digital/custom/layout.

Nice to have

  • Exposure to datapath/arith/bus/standard-cell co-design boundaries (device-level parasitics, signal-integrity hand-offs, and glitch reduction).
  • Scripting for automation (Python/Tcl) in mixed-signal flows
  • Familiarity with compute-in-memory or memory-periphery constraints (matching, IR/EM, variation, testability)

Apply Send your CV and a short note (2–3 paragraphs on a design you owned, your toughest bug & how you solved it, an intro on what you like to do and how you see yourself as an engineer) Interview flow (indicative)

  • 30-min intro with HR (role/context)
  • First Technical deep dive
  • Second Technical Deep Dive
  • (Optional) Third Technical Deep Dive
  • Systems/product conversation with management

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